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SUM110N10-09
Vishay Siliconix
THERMAL RATINGS
120
100
8 0
1000
100
Limited
10 μs
100 μ s
60
40
20
0
10
1
0.1
b y R DS(on)*
T C = 25 °C
Single P u lse
1 ms
10 ms
100 ms, DC
0
25
50
75
100
125
150
175
0.1
1
10
100
1000
2
1
0.1
0.01
T C - Am b ient Temperat u re (°C)
Maximum Avalanche and Drain Current
vs. Case Temperature
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single P u lse
* V GS
V DS - Drain-to-So u rce V oltage ( V )
minim u m V GS at w hich R DS(on) is specified
Safe Operatin g Area
10 -4
10 -3
10 -2
10 -1
1
10
S qu are W a v e P u lse D u ration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?70677 .
Document Number: 70677
S10-0644-Rev. G, 22-Mar-10
www.vishay.com
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